Keszoox JST 2.0mm HY Connectors

About

JST 2.0mm HY Series Connectors — Compact Wire-to-Board Interconnects for Space-Critical Designs The JST HY series at 2.0mm pitch delivers a refined balance of compact footprint and robust electrical performance, purpose-built for applications where board space is limited but connection reliability cannot be compromised. Widely adopted in portable consumer electronics, compact robotics, IoT sensor modules, and embedded computing platforms, the HY series brings JST's hallmark precision manufacturing to medium-fine pitch wire-to-board interconnection. Key Technical Advantages 2.0mm Fine Pitch: Enables high connector density on compact PCBs, supporting multi-channel signal and low-power routing in space-constrained designs without sacrificing ease of hand assembly or rework. Positive-Latch Retention: Secure snap-fit locking mechanism prevents accidental unmating under vibration and repeated handling, critical for portable and mobile devices subject to mechanical stress. Tin-Plated Phosphor Bronze Contacts: Delivers stable, low contact resistance over extended service life with proven resistance to fretting corrosion in thermally cycled environments. High-Temperature PA66 Housing: UL94 V-0 rated nylon housing withstands continuous operation up to 105°C, maintaining structural integrity and dielectric performance across demanding thermal environments. Wide Pin Count Range: Available from 2-pin to 15-pin configurations, accommodating simple power rails through multi-channel sensor and data bus harness assemblies. Fine Wire Compatibility: Accepts 26–30 AWG wire, compatible with standard JST HY crimp tooling for consistent, production-ready terminations. RoHS & REACH Compliant: All materials meet current EU environmental directives, supporting global market access for finished products. Typical Applications Portable consumer electronics: handheld devices, compact audio, and display modules Embedded computing: single-board computers, development boards, and module interco