Dam & Fill
A collection page of Polysciences
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Products
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Published
2025/10/07
About
Polysciences’ dam & fill encapsulants are engineered formulations used in electronic packaging where a high-viscosity “dam” is dispensed to define boundaries then a low-viscosity “fill” flows within to encapsulate components. These products deliver strong adhesion, excellent thermal performance, controlled flow, and stability to protect PCBs and bonded devices under harsh conditions.